HANWHA SM481PLUS SMT Placement Machine Precision High Speed Assembly for Advanced PCB Manufacturing

HANWHA SM481PLUS SMT Placement Machine Precision High Speed Assembly for Advanced PCB Manufacturing Trade Information

Minimum Order Quantity
1 Unit

Payment Terms
Cash in Advance (CID)

Supply Ability
20 Units Per Month

Delivery Time
30 Days

Main Export Market(s)
Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa

About HANWHA SM481PLUS SMT Placement Machine Precision High Speed Assembly for Advanced PCB Manufacturing

Prices are for show only, please contact us for exact price.

Product Description

The HANWHA SM481PLUS is an advanced SMT placement machine designed for high-speed and high-precision PCB assembly. Offering exceptional versatility, the SM481PLUS is capable of handling a wide range of components, from fine-pitch chips to larger devices, making it suitable for both high-mix and high-volume production lines. Featuring an advanced vision system and precise alignment capabilities, it ensures optimal component placement with minimal defects. Its intuitive software and automated processes streamline production workflows, enhancing operational efficiency and reducing downtime. The HANWHA SM481PLUS is trusted by electronics manufacturers in industries such as telecommunications, automotive, and consumer electronics, offering reliability and consistency in high-demand production environments. With its robust construction and flexible feeder systems, the SM481PLUS is an ideal choice for manufacturers looking to boost productivity while maintaining high-quality standards in their PCB assembly processes.

Product Specifications

Machine Model	SM481
Alignment Flying	Vision + Stage Vision (Option)
Number of Spindles	10 Spindles x 1 Gantry
Placement Speed	38,000 CPH (Optimum)
Placement Accuracy	Chip/QFP	50m@+3/Chip, 30m@+3/QFP
		(Based on the standard chips)
Component Range	Flying Vision	FOV 24	0402(01005 inch) ~ 16mm IC, Connector (Lead Pitch 0.4mm)
			* BGA, CSP (Ball Pitch 0.4mm)
	Stage Vision (Option)	FOV 35	~ 16mm IC, Connector (Lead Pitch 0.3mm)
			* BGA, CSP (Ball Pitch 0.4mm)
			~ 32mm IC, Connector (Lead Pitch 0.4mm)
			* BGA, CSP (Ball Pitch 0.5mm)
		FOV 45	~ 32mm IC, Connector (Lead Pitch 0.4mm)
			* BGA, CSP (Ball Pitch 0.5mm)
			~ 42mm IC, Connector (Lead Pitch 0.5mm)
			* BGA, CSP (Ball Pitch 1.0mm)
	Max. Height		10mm (Option : 15mm)
Board Dimension (mm)	Minimum		50(L) x 40(W)
	Maximum		460(L) x 400(W)
	PCB Thickness		0.38 ~ 4.2
Feeder Capacity	120ea / 112ea (Docking Cart)
Utility	Power		AC 200 / 208 / 220 / 240 / 380 / 415 V
			(50/60Hz, 3Phase) Max. 3.5kVA
	Air Consumption		0.5 ~ 0.7MPa (5 ~ 7kgf/cm2) 180N/min,
			50N/min (Vacuum Pump)
Mass	Approx. 1,655kg
External Dimension(mm)	1,650(L) x 1,680(D) x 1,530(H)