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YAMAHA YSi-V 3D AOI System Advanced PCB Inspection & Quality Control for Electronics Manufacturing

YAMAHA YSi-V 3D AOI System Advanced PCB Inspection & Quality Control for Electronics Manufacturing Specification

Machine Type
Inline High-Speed AOI

Operating Temperature
15C to 35C

Drive
Precision Motorized Conveyor

Connectivity Options
Ethernet, USB, Factory Automation Interface

Frequency
50/60 Hz

Cooling System
Air Cooled

Production Capacity
Variable, up to 80 cm2/sec inspection speed

Control System
Computerized, Integrated Touch Panel

Power Rating
1.2 kVA

Frame Type
Reinforced Steel, Anti-vibration

Voltage
AC 200-240V, 50/60Hz

Features
3D & 2D Inspection, Defect Detection, Height Measurement, Flexible Programming

Lubricating System
Maintenance-free

Accuracy
High-precision 3D Solder Joint and Component Inspection

Model No
YSi-V

Noise Level
< 65 dB

Motor Power
Integrated

Product Type
3D AOI (Automated Optical Inspection) System

Technology
3D Imaging, Multi-angle Projection, Advanced Camera System

Power Source
Electric

Operating Type
Automatic

Power
Approx. 1.2 kVA

Surface Treatment
Anti-Static Coated Frame

Dimension (L*W*H)
970 mm 1,440 mm 1,450 mm

Weight (kg)
Approx. 750 kg

Color
White & Blue

Usage & Applications
PCB Inspection for Electronics Manufacturing

Software
Yamaha Proprietary AOI Software Suite

SMEMA Compatibility
Yes

Programing Method
Graphical User Interface, CAD Data Import

Camera Resolution
Up to 12 Mega Pixels, High-Speed Imaging

Floor Loading
Inline/Stand-alone

Automatic Width Adjustment
Yes

Component Height Range
Up to 25 mm (Top), 40 mm (Bottom)

Lighting System
Multi-color LED, Programmable Angles

Data Output Formats
Customizable Reports, Traceability Data, SPC

Installation Requirement
Level Floor, Ambient Temperature Controlled

Security
User Access Control with Multiple Levels

Alarm System
Visual and Audible Alarms for Defects

Inspection Modes
3D Solder Paste, Pre-reflow, Post-reflow, 2D/3D Hybrid

Component Types Detectable
Chips, ICs, Solder Joints, Connectors, Foreign Material, etc.

PCB Size Supported
Max 610 mm 510 mm (L W); Min 50 mm 50 mm

YAMAHA YSi-V 3D AOI System Advanced PCB Inspection & Quality Control for Electronics Manufacturing Trade Information

Minimum Order Quantity
1 Unit

Payment Terms
Cash in Advance (CID)

Supply Ability
20 Units Per Month

Delivery Time
30 Days

Main Export Market(s)
Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa

About YAMAHA YSi-V 3D AOI System Advanced PCB Inspection & Quality Control for Electronics Manufacturing

Prices are for show only, please contact us for exact price.

Product Description

The YAMAHA YSi-V 3D AOI System is a cutting-edge solution for advanced PCB inspection and quality control, designed to meet the rigorous demands of modern electronics manufacturing. Leveraging state-of-the-art 3D vision technology, this system ensures precise detection of defects, including solder joint issues, component misalignment, and missing parts, even on complex PCB assemblies. Ideal for high-mix and high-volume production environments, the YSi-V enhances quality assurance while reducing manual inspection time and costs. Its intuitive interface and automated inspection capabilities streamline workflows, making it a valuable tool for industries such as automotive, telecommunications, and consumer electronics. With its robust design and real-time monitoring features, the YSi-V minimizes production downtime and maximizes throughput, ensuring consistent product quality. Whether you're inspecting fine-pitch components or large-scale PCB assemblies, the YAMAHA YSi-V 3D AOI System delivers unmatched accuracy, efficiency, and reliability, helping you maintain competitive edge in today's fast-paced manufacturing landscape

Product Specifications

Model	Yamaha YSi-V
Object Substrate	L610xW560L50xW50(single track model) Support L750mm long baseboard (optional)
Camera Pixel	12 million pixels					5 million Pixel
Type	12M TypeHS2		12M TypeS		12M TypeDF	5M
Resolution	12um	7 um	12um	7um	12um	18um
Object to be checked	Condition of components just after mounting, cured soldering and components
Power supply specifications	3 phase 200/208/220/230/240/400/416V10% 50/60Hz
Air Supply	0.4MPa or more, clean and dry condition
Dimensions (except protruding part)	L1,252mmxW1,498mmxH1.550mm
Main body weight	Approx. 1,300kg

3D Imaging with High-Speed Inspection

Equipped with state-of-the-art 3D imaging technology and a high-resolution camera system, the YAMAHA YSi-V AOI system delivers precise height measurements and defect detection at speeds up to 80 cm2/sec. Its multi-angle projection and programmable lighting provide detailed assessment of solder joints and surface-mounted components, ensuring quality control throughout various stages of PCB manufacturing.

User-Friendly Interface and Flexible Programming

The YSi-V system is fitted with a graphical user interface and supports CAD data import, simplifying setup and programming. Its fully computerized control system, integrated touch panel, and automatic width adjustment allow operators to tailor inspection routines for a wide variety of board types and layouts without extensive manual intervention.

Comprehensive Connectivity and Reporting

Designed for seamless integration into modern production lines, the YSi-V offers Ethernet, USB, and factory automation interfaces. It generates comprehensive inspection reports, provides traceability data, and supports SPC output. The embedded security system with user access control ensures operational integrity, while visual and audible alarms alert operators to any detected defects.

FAQ's of YAMAHA YSi-V 3D AOI System Advanced PCB Inspection & Quality Control for Electronics Manufacturing:

Q: How does the YAMAHA YSi-V AOI system improve PCB inspection processes?

A: The YSi-V automates advanced visual inspection, employing 3D imaging and multi-angle projection to detect defects in solder joints, components, and assembly quality. This reduces human error, accelerates inspection, and helps maintain high standards for electronics manufacturing.

Q: What PCB sizes and components can the YSi-V accommodate?

A: The system supports PCB sizes ranging from 50 mm x 50 mm up to 610 mm x 510 mm. It effectively inspects a wide range of components, including chips, ICs, solder joints, connectors, and foreign materials, with component heights up to 25 mm (top side) and 40 mm (bottom side).

Q: When should I use 3D versus 2D or hybrid inspection modes?

A: Use 3D inspection mode for applications requiring precise height and volume measurement, particularly for solder joints and paste. 2D inspection is suitable for verifying surface features, while the hybrid mode combines both approaches for comprehensive analysis and higher detection accuracy.

Q: Where can the YSi-V be installed in a manufacturing facility?

A: The YSi-V can be configured for inline or stand-alone floor loading. It requires installation on a level floor in a temperature-controlled environment (15C to 35C) to ensure stable and optimal performance within electronics manufacturing lines.

Q: What are the key steps in programming and operating the YSi-V AOI system?

A: Programming and operation involve importing CAD data or using the graphical user interface to define inspection targets and parameters. Automatic width adjustment and intuitive touch panel controls make setup fast and flexible. The system then conducts inspection cycles automatically, presenting real-time results and defect alerts.

Q: How does the YSi-V benefit electronics manufacturers?

A: Manufacturers benefit from higher inspection accuracy, reduced cycle times, enhanced defect detection, and detailed reporting. Automated operation, robust traceability features, and minimal regular maintenance (including an air-cooled, maintenance-free lubricating system) support increased throughput and consistent quality control.