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Siplace SX1 SX2 Pick and Place Machine Precision Component Placement for High Mix High Volume SMT Production

Siplace SX1 SX2 Pick and Place Machine Precision Component Placement for High Mix High Volume SMT Production Specification

Product Type
Automatic SMT Pick and Place Machine

Material
High-grade steel, alloy components, industrial electronic systems

Capacity
Up to 45,000 cph (SX1), Up to 72,000 cph (SX2)

Computerized
Yes

Automatic Grade
Fully Automatic

Control System
Windows-based SIPLACE software interface, touchscreen operation

Processing Type
Precision SMT Component Placement

Voltage
230V AC, 50/60Hz

Power
Approx. 5 kW

Dimension (L*W*H)
1650 mm x 2700 mm x 1500 mm (varies with configuration)

Weight
Approx. 3,200 kg

Color
Industrial Grey/White

Component Types Supported
Chips, ICs, BGAs, QFPs, connectors, LEDs, odd-shaped components

Component Range
01005 (0.4 x 0.2 mm) to 80 x 110 mm, up to 15 mm height

Networking
SMEMA, MES-ready, remote diagnostics

ESD Protection
Integrated throughout handling and placement

Compliances
CE, RoHS, IPC standards

Operating Environment Temperature
15-35C

Vision System
High-resolution camera alignment, on-the-fly recognition

PCB Size (Min/Max)
50 mm x 50 mm / 850 mm x 560 mm

Nozzle Changers
Automatic smart nozzle change

Placement Accuracy
21 m @ 3 Sigma

Data Traceability
Full component and board traceability support

Changeover Time
Ultra-fast, software-assisted changeover

Feeder Capacity
Up to 120 (8 mm) Intelligent Feeders

Siplace SX1 SX2 Pick and Place Machine Precision Component Placement for High Mix High Volume SMT Production Trade Information

Minimum Order Quantity
1 Unit

Payment Terms
Cash in Advance (CID)

Supply Ability
20 Units Per Month

Delivery Time
30 Days

Main Export Market(s)
Asia, Australia, South America, Central America, North America, Eastern Europe, Western Europe, Middle East, Africa

About Siplace SX1 SX2 Pick and Place Machine Precision Component Placement for High Mix High Volume SMT Production

Prices are for show only, please contact us for exact price.

Product Description

The Siplace SX1 SX2 pick and place machine is engineered for both high-speed and high-precision component placement in SMT (Surface Mount Technology) applications. Designed to meet the demands of high-mix and high-volume production environments, the SX1 and SX2 provide exceptional flexibility, handling a wide range of components from fine-pitch devices to larger, complex parts. Equipped with advanced vision systems and automatic feeder setups, the Siplace SX1 SX2 ensures precise placement, minimizing defects and maximizing throughput. Its easy-to-use interface and automated processes streamline setup and operation, enhancing productivity and reducing downtime. The Siplace SX1 SX2 is an ideal choice for industries such as electronics manufacturing, automotive, and telecommunications, offering robust performance and consistent quality in every production cycle

Product Specifications

Technical data*	SIPLACE SX1	SIPLACE SX2
Placement speed	43,000 cph	86,500 cph
Placement speed(IPC)	33,000 cph	66,000 cph
Feeder capacity	120 x 8mm slots
Component spectrum	0201(metric) to 200 mm x 110 mm x 50 mm
Boand size	50 mm x 50 mm to 1,525 mm x 560 mm
Machine dimensions (L x W x H)	1.5mm x 2.8m x 1.8m
Placement heads	Placement Head CP20P2, Placement Head CPP, Placement Head TH
Placement accuracy	22 m @ 3 (with Placement Head TH)
Conveyors	Single-track conveyor, flexible dual-track conveyor

Unmatched Placement Accuracy and Speed

Siplace SX1 and SX2 deliver impressive placement accuracy of 21 microns at 3 Sigma and rapid throughput-up to 45,000 cph for SX1 and 72,000 cph for SX2. These features ensure efficient, reliable assembly of diverse components, from tiny chips to large connectors, maximizing productivity and flexibility for both high-mix and high-volume production environments.

Flexible and Intelligent Feeder System

With capacity for up to 120 intelligent 8-millimeter feeders, these pick and place machines streamline component management and changeovers. Automatic smart nozzle changers and software-guided setups significantly reduce downtime, supporting quick production transitions and optimized material handling for a wide array of PCB assembly requirements.

Advanced Vision and Traceability

Equipped with high-resolution camera alignment and on-the-fly recognition, the Siplace SX series ensures precise component positioning on each PCB. The system also offers full component and board traceability, enabling manufacturers to meet stringent quality and process standards while facilitating data-driven optimization and accountability.

FAQ's of Siplace SX1 SX2 Pick and Place Machine Precision Component Placement for High Mix High Volume SMT Production:

Q: How does the Siplace SX1/SX2 ensure high precision in component placement?

A: The Siplace SX1/SX2 utilizes a high-resolution camera vision system for accurate alignment and on-the-fly component recognition. Combined with robust software algorithms and precise mechanical design, the machines achieve 21 microns placement accuracy at 3 Sigma, ensuring consistent, reliable results.

Q: What range of components and PCB sizes can the Siplace SX series handle?

A: These machines are designed to support a broad component range, including 01005 chips (0.4 x 0.2 mm), ICs, BGAs, QFPs, connectors, LEDs, and odd-shaped parts up to 80 x 110 mm and 15 mm in height. PCB sizes from 50 mm x 50 mm up to 850 mm x 560 mm are supported.

Q: When is ultra-fast changeover most beneficial in production?

A: Ultra-fast, software-assisted changeover saves valuable time during high-mix production runs where switching between different jobs frequently occurs. This capability minimizes downtime and maximizes operational throughput, making it highly advantageous for dynamic manufacturing environments.

Q: Where can the Siplace SX1/SX2 be installed and operated?

A: The Siplace SX series can be integrated into SMT assembly lines in a variety of facilities, such as electronics manufacturing plants, OEM production sites, and PCB assembly houses. It operates within an ambient temperature range of 15-35C and requires 230V AC power supply.

Q: What benefits does full data traceability provide to manufacturers?

A: Full component and board traceability supports compliance with quality standards (CE, RoHS, IPC), enables process optimization based on real-time data, and assists in fault analysis. This leads to improved product quality, accountability, and easier adherence to regulatory requirements.

Q: How does the machine integrate with factory networks and MES systems?

A: Built-in SMEMA compatibility, MES readiness, and options for remote diagnostics allow the Siplace SX series to seamlessly connect with factory IT infrastructures, facilitating centralized control, monitoring, and maintenance over the production process.

Q: What makes the Siplace SX1/SX2 suitable for both high-mix and high-volume production in India?

A: Its high-speed placement, extensive component support, flexible feeders, rapid changeovers, and intuitive software make these machines ideal for India's diverse electronics sector, supporting both low-volume, high-complexity, and mass production applications.