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Jedec IC Tray for SOIC-16

Jedec IC Tray for SOIC-16 Specification

Surface Finish
Smooth, Matte

Features
Stackable, ESD protection, Heat resistant, Reusable

Capacity
Accommodates up to 66 SOIC-16 devices per tray

Size
Fits SOIC-16 Packages

Usage & Applications
IC device storage, transport and handling in electronics manufacturing

Shape
Rectangular

Product Type
JEDEC IC Tray for SOIC-16

Material
Antistatic Polymer/ESD Safe Plastic

Technology
Injection Molded Tray

Surface Treatment
Antistatic/ESD

Dimension (L*W*H)
315mm 135mm 7.62mm (approx.)

Weight
85g (approx.)

Color
Black

JEDEC Standard
MO-150

Tray Pitch
7.62mm (SOIC-16 module to module spacing)

Operating Temperature Range
-40C to +120C

Flammability Rating
UL 94 V-0

Moisture Sensitivity
Low

RoHS Compliance
Yes

Tray Depth
6mm (approx.)

Chemical Resistance
Good (resistant to most solvents and cleaners)

Stacking Compatibility
Aligns with JEDEC tray stackers

Jedec IC Tray for SOIC-16 Trade Information

Minimum Order Quantity
1 Piece

Payment Terms
Cash in Advance (CID)

Supply Ability
5000 Pieces Per Month

Delivery Time
7 Days

Main Export Market(s)
Asia, North America, South America, Australia, Central America, Africa, Eastern Europe, Western Europe, Middle East

About Jedec IC Tray for SOIC-16

Prices are for show only, please contact us for exact price

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Precision Engineering for SOIC-16 Devices

This tray is specially engineered to fit SOIC-16 integrated circuits, maintaining a precise 7.62mm pitch for secure, organized storage. Its design aligns with JEDEC standard MO-150, ensuring compatibility across automated manufacturing and handling equipment. The robust construction safeguards sensitive devices during transport and handling.

Reliable ESD and Heat Protection

Manufactured from antistatic polymer and treated for ESD safety, the tray effectively shields components from electrostatic discharge. With a high operating temperature range (-40C to +120C) and UL 94 V-0 flammability rating, it supports safe operation in diverse environments, protecting valuable IC devices from thermal and electrical hazards.

Flexible Use and Reusability

Intended for repeated use, the tray withstands most solvents and cleaners and can be easily integrated into existing storage, transport, and automated processing systems. Stackable and RoHS-compliant, this solution lowers long-term costs for electronics manufacturers, distributors, and exporters by enabling reliable reuse without performance degradation.

FAQ's of Jedec IC Tray for SOIC-16:

Q: How is the JEDEC IC Tray for SOIC-16 used in electronics manufacturing?

A: This tray securely holds and organizes up to 66 SOIC-16 IC packages for storage, transport, and handling during assembly processes, ensuring devices remain protected from ESD and mechanical damage.

Q: What benefits does the antistatic material provide for sensitive IC devices?

A: The antistatic polymer construction, coupled with a smooth, matte surface, delivers ESD protection that significantly reduces the risk of static discharge, preserving the integrity of sensitive electronic components during handling and shipping.

Q: When should I use this tray instead of generic packaging solutions?

A: Use this tray whenever JEDEC standard compliance, precise device fit, heat resistance, stackability, and ESD protection are essential requirements-especially in professional electronics manufacturing, distribution, or exportation.

Q: Where can the tray be stored or utilized effectively?

A: The tray is designed for compatibility with standard JEDEC tray stackers and can be effectively used in clean rooms, storage facilities, automated assembly lines, and transportation between manufacturing sites.

Q: What is the process for cleaning and reusing the tray?

A: The tray features strong chemical resistance, allowing cleaning with most industry-standard solvents and cleaners. Its robust build and smooth surface facilitate repeated use without degradation.

Q: How does the JEDEC tray ensure safe handling and stacking of SOIC-16 packages?

A: The tray features precise module-to-module spacing, a 6mm depth, and alignment for stacking compatibility, which ensures secure stacking and handling while preventing physical or electrical damage during logistics operations.