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    SAMSUNG DECAN S2 SMT Mounter High Speed High Precision Placement for PCB Assembly

    SAMSUNG DECAN S2 SMT Mounter  High Speed  High Precision Placement for PCB Assembly
    SAMSUNG DECAN S2 SMT Mounter  High Speed  High Precision Placement for PCB Assembly
    SAMSUNG DECAN S2 SMT Mounter  High Speed  High Precision Placement for PCB Assembly
    SAMSUNG DECAN S2 SMT Mounter  High Speed  High Precision Placement for PCB Assembly
    SAMSUNG DECAN S2 SMT Mounter  High Speed  High Precision Placement for PCB Assembly
    SAMSUNG DECAN S2 SMT Mounter  High Speed  High Precision Placement for PCB Assembly
    SAMSUNG DECAN S2 SMT Mounter  High Speed  High Precision Placement for PCB Assembly
     

    SAMSUNG DECAN S2 SMT Mounter High Speed High Precision Placement for PCB Assembly Trade Information

    • Minimum Order Quantity
    • 1 Unit
    • Payment Terms
    • Cash in Advance (CID)
    • Supply Ability
    • 20 Units Per Month
    • Delivery Time
    • 30 Days
    • Main Export Market(s)
    • South America, Western Europe, Australia, Asia, Eastern Europe, Africa, Central America, North America, Middle East
     

    About SAMSUNG DECAN S2 SMT Mounter High Speed High Precision Placement for PCB Assembly

    Prices are for show only, please contact us for exact price.
    Product Description
    The SAMSUNG DECAN S2 is a high-performance SMT mounter designed to deliver fast, precise component placement for PCB assembly. Featuring advanced vision technology and flexible placement capabilities, the DECAN S2 is ideal for both high-mix and high-volume production lines. It excels in handling a wide range of components, including fine-pitch devices and larger components, making it suitable for diverse industries such as electronics, automotive, and telecommunications. With an intuitive user interface, automatic feeder systems, and real-time monitoring, the SAMSUNG DECAN S2 enhances operational efficiency, reduces setup times, and minimizes errors in production. Its robust construction ensures reliable performance even in demanding environments, providing manufacturers with a reliable solution for improving throughput, reducing defects, and maintaining high-quality standards in their SMT assembly processes

    Product Specifications
    Placement speed(Optimum 90.000 CPH
    Placement accuracy 28 m(03015 chip)
    25 m (IC)
    Repeatability 0,01 mm
    Minimum PCB size (L x W) 50 x40 mm
    Maximum PCB size(LxW) 510 x460 mm(Standard)
    up to 740 x460 mm (Option)
    PCB thickness From 0,38 mm up to 4,2 mm
    8 mm feeder slots 120
    Power supply requirements 3 phase,200/208/220/240/380/415 V(50/60 Hz)
    Maximum power consumption 5,0 kVA
    Air supply requirements 50 Nl/min using vacuum pump
    Machine weight 1.800 kg
    Machine dimensions
    (LxWxH)
    1.430 x 1.740 x 1.485 mm

    Price 6.0 USD ($)/ Unit

    • Minimum Order Quantity
    • 1 Unit
    • Supply Ability
    • 20 Units Per Month
    • Delivery Time
    • 30 Days
    • Main Export Market(s)
    • South America, Western Europe, Australia, Asia, Eastern Europe, Africa, Central America, North America, Middle East
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