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    SAMSUNG SM411 Pick and Place Machine High Speed High Precision SMT Component Placement for PCB Assembly

    SAMSUNG SM411 Pick and Place Machine High Speed High Precision SMT Component Placement for PCB Assembly
    SAMSUNG SM411 Pick and Place Machine High Speed High Precision SMT Component Placement for PCB Assembly
    SAMSUNG SM411 Pick and Place Machine High Speed High Precision SMT Component Placement for PCB Assembly
    SAMSUNG SM411 Pick and Place Machine High Speed High Precision SMT Component Placement for PCB Assembly
    SAMSUNG SM411 Pick and Place Machine High Speed High Precision SMT Component Placement for PCB Assembly

    SAMSUNG SM411 Pick and Place Machine High Speed High Precision SMT Component Placement for PCB Assembly Specification

    • Product Type
    • Pick and Place Machine
    • Material
    • High-grade steel, industrial electronics
    • Capacity
    • Up to 38,000 CPH (Components per hour) - chip (Optimum)
    • Computerized
    • Yes
    • Automatic Grade
    • Fully Automatic
    • Control System
    • PC-based control with touchscreen interface
    • Processing Type
    • Surface Mount Technology (SMT) Component Placement
    • Voltage
    • AC 200-240V, 50/60Hz
    • Power
    • Maximum 5.5 kVA
    • Dimension (L*W*H)
    • 1,650 x 1,680 x 1,445 mm
    • Weight
    • 1,650 kg
    • Color
    • White & Blue
    • Compressed Air Requirements
    • 0.5 MPa, 100 Nl/min
    • Feeder Slots
    • 120 slots (8 mm) max
    • Vision System
    • HD Camera with component recognition and alignment
    • PCB Size (Option)
    • Max 610 x 510 mm
    • Component Height
    • Up to 15 mm (option: up to 22 mm)
    • PCB Size (Standard)
    • Max 510 x 460 mm
    • Conveyor System
    • Automatic width adjustment
    • Component Range
    • 0201 (metric) to 22 mm (H=6 mm), QFP/PLCC/BGA/CSP/SOP/Chip
    • PCB Thickness
    • 0.4 - 4.2 mm
    • Software Features
    • Optimized SMART software, offline programming
    • Operation Environment
    • 15C - 35C, relative humidity 35 - 75%
    • Placement Head
    • 6 electric high-precision nozzles (on-the-fly, vision centering)
    • Repeat Placement Accuracy
    • 0.03 mm (3 sigma)
     

    SAMSUNG SM411 Pick and Place Machine High Speed High Precision SMT Component Placement for PCB Assembly Trade Information

    • Minimum Order Quantity
    • 1 Unit
    • Payment Terms
    • Cash in Advance (CID)
    • Supply Ability
    • 20 Units Per Month
    • Delivery Time
    • 30 Days
    • Main Export Market(s)
    • Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa
     

    About SAMSUNG SM411 Pick and Place Machine High Speed High Precision SMT Component Placement for PCB Assembly

    Prices are for show only, please contact us for exact price.

    Product Description

    The SAMSUNG SM411 is a high-performance pick and place machine designed for precise and efficient SMT (Surface Mount Technology) component placement in PCB assembly. Featuring advanced vision systems and flexible feeder configurations, the SM411 delivers high-speed operation while ensuring accurate placement of components, from fine-pitch devices to larger components. The machine is ideal for both high-mix and high-volume production environments, making it perfect for industries such as electronics, automotive, and telecommunications. The SAMSUNG SM411 is equipped with an intuitive user interface, automated setup features, and real-time monitoring to enhance productivity and reduce setup times. Its reliable performance and robust construction make it a trusted choice for manufacturers looking to optimize their production lines while maintaining high-quality standards. The SM411 helps improve throughput, reduce defects, and support continuous production without compromising precision.


    Product Specifications

    Model SM411
    Number of Spindles: 6 Spindles x 2 Gantry
    Camera Flying Vision
    Mounting Speed: Chip 42,000 CPH (IPC9850)
    SOP 30,000 CPH (IPC9850)
    Mounting accuracy Chip 50 @ 3 / Chip (Based on the standard chips)
    Narrow Pitch Mounting 0.1mm (0603) / 0.15mm (1005)
    Components Range 0603 14mm Chip, QFP, BGA (Option: 0402 Please contact us. The more information will be available upon your request.)
    Min pin pitch (QFP)/Min ball pitch (BGA) 0.5mm (QFP) / 0.65mm (BGA)
    Max Height Components H = 12mm
    Board Size (mm) Min: 50 (L) x 40 (W)
    Max: 510 (L) x 460 (W) (Single Lane Mode)
    460 (L) x 250 (W) (Dual Lane Mode)
    PCB thickness 0.38mm 4.2mm
    Number of feeders 120ea / 112ea (Feeder changer)
    Power AC200 / 208/220/240/380/415 V (50 / 60Hz, 3Phase), Max. 5.0kVA
    Air 0.5 0.7MPa (5.1 7.1kgf / cm2), 300NL/Min
    Weight 1,820kg
    Dimensions (mm) 1,650 (L) x 1,690 (D) x 1,535 (H)
    Machine comes with 6 high quality new nozzles ( not include 0201 and smaller nozzles) ;
    Feeders will be charged in additional



    High-Speed, Precision SMT Placement

    Equipped with up to 120 feeder slots and a six-nozzle, on-the-fly placement head, the SAMSUNG SM411 maximizes throughput, achieving up to 38,000 CPH. Its HD camera-based vision system ensures tightly controlled alignment and repeatable accuracy for every component placed, ideal for high mix and high volume PCB assembly.


    Versatile Component and PCB Handling

    Supporting a comprehensive range of components from micro-sized 0201 (metric) up to 22 mm form factors, the SM411 excels with QFP, PLCC, BGA, CSP, SOP, and chip packages. Flexible PCB sizing options and adjustable conveyor mechanisms enable seamless processing for various board dimensions and assembly requirements.


    Optimized Operation and Software Control

    Integrated SMART software streamlines programming and job changeovers, supporting offline preparation to minimize downtime. The user-friendly PC-based touchscreen interface ensures intuitive operation, while robust industrial electronics and sturdy construction provide reliability in continuous manufacturing environments.

    FAQ's of SAMSUNG SM411 Pick and Place Machine High Speed High Precision SMT Component Placement for PCB Assembly:


    Q: How does the SAMSUNG SM411 ensure precise component placement on PCBs?

    A: The SM411 utilizes six high-precision electric nozzles with on-the-fly placement and an HD vision system for real-time component recognition and centering, achieving repeatable placement accuracy of 0.03 mm (3 sigma) during PCB assembly.

    Q: What types and sizes of components can the SM411 handle?

    A: It supports a wide range, from micro 0201 metric chips up to 22 mm components (height up to 15 mm standard, 22 mm optional), including QFP, PLCC, BGA, CSP, SOP, and various chip components, making it versatile for diverse PCB assembly tasks.

    Q: When is offline programming and job setup available on this machine?

    A: The Optimized SMART software allows users to perform offline programming and job setup, enabling preparation of PCB assembly tasks without interrupting current production, which reduces changeover times and boosts productivity.

    Q: Where is the SAMSUNG SM411 most effectively used?

    A: This machine is best suited for electronics manufacturing environments requiring fast, precise, and automated SMT component placement, including contract manufacturers, OEMs, and PCB assembly plants catering to high-quality, high-volume production.

    Q: What is the process for adjusting to different PCB sizes and thicknesses?

    A: The SM411 features an automatic width-adjustable conveyor and supports PCBs up to 610 x 510 mm with thicknesses from 0.4 to 4.2 mm, facilitating fast adaptation to varying board specifications without manual intervention.

    Q: How does the machine improve operational efficiency?

    A: With high-speed placement (up to 38,000 CPH), a large feeder slot capacity, and easy-to-use touchscreen controls, the machine streamlines workflow, reduces downtime through efficient job management, and minimizes manual handling.

    Q: What are the primary benefits of adopting the SM411 for PCB assembly?

    A: Adopting the SM411 yields increased throughput, improved placement accuracy, reduced setup times, and reliable automation, all contributing to higher production quality, greater flexibility, and a competitive edge in electronics manufacturing.

    • Minimum Order Quantity
    • 1 Unit
    • Supply Ability
    • 20 Units Per Month
    • Delivery Time
    • 30 Days
    • Main Export Market(s)
    • Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa
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