SAMSUNG SM411 Pick and Place Machine High Speed High Precision SMT Component Placement for PCB Assembly

SAMSUNG SM411 Pick and Place Machine High Speed High Precision SMT Component Placement for PCB Assembly Trade Information

Minimum Order Quantity
1 Unit

Payment Terms
Cash in Advance (CID)

Supply Ability
20 Units Per Month

Delivery Time
30 Days

Main Export Market(s)
Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa

About SAMSUNG SM411 Pick and Place Machine High Speed High Precision SMT Component Placement for PCB Assembly

Prices are for show only, please contact us for exact price.

Product Description

The SAMSUNG SM411 is a high-performance pick and place machine designed for precise and efficient SMT (Surface Mount Technology) component placement in PCB assembly. Featuring advanced vision systems and flexible feeder configurations, the SM411 delivers high-speed operation while ensuring accurate placement of components, from fine-pitch devices to larger components. The machine is ideal for both high-mix and high-volume production environments, making it perfect for industries such as electronics, automotive, and telecommunications. The SAMSUNG SM411 is equipped with an intuitive user interface, automated setup features, and real-time monitoring to enhance productivity and reduce setup times. Its reliable performance and robust construction make it a trusted choice for manufacturers looking to optimize their production lines while maintaining high-quality standards. The SM411 helps improve throughput, reduce defects, and support continuous production without compromising precision.

Product Specifications

Model	SM411
Number of Spindles:	6 Spindles x 2 Gantry
Camera	Flying Vision
Mounting Speed:	Chip 42,000 CPH (IPC9850)
Mounting Speed:	SOP 30,000 CPH (IPC9850)
Mounting accuracy	Chip 50 @ 3 / Chip (Based on the standard chips)
Narrow Pitch Mounting	0.1mm (0603) / 0.15mm (1005)
Components Range	0603 ~ 14mm Chip, QFP, BGA (Option: 0402 Please contact us. The more information will be available upon your request.)
Min pin pitch (QFP)/Min ball pitch	(BGA) 0.5mm (QFP) / 0.65mm (BGA)
Max Height Components	H = 12mm
Board Size (mm)	Min: 50 (L) x 40 (W)
	Max: 510 (L) x 460 (W) (Single Lane Mode)
	460 (L) x 250 (W) (Dual Lane Mode)
PCB thickness	0.38mm ~ 4.2mm
Number of feeders	120ea / 112ea (Feeder changer)
Power	AC200 / 208/220/240/380/415 V (50 / 60Hz, 3Phase), Max. 5.0kVA
Air	0.5 ~ 0.7MPa (5.1 ~ 7.1kgf / cm2), 300NL/Min
Weight	1,820kg
Dimensions (mm)	1,650 (L) x 1,690 (D) x 1,535 (H)
Machine comes with 6 high quality new nozzles ( not include 0201 and smaller nozzles) ;
Feeders will be charged in additional